Senior Electronic Designer

IAUKWGLAIKV Apply for this position and join us in building Europe’s next generation infrastructure. Our values are rooted in responsibility, readiness, and long term thinking. We believe sovereignty must be designed into systems from the start. Readiness is achieved through capability, not procurement. Autonomy is infrastructure, not a feature. We build with the understanding that modern systems carry long term consequences. That is why we prioritise reliability over novelty, integration over isolation, and sustained capability over short term advantage. Apply for this position Position Role Overview Reports to: Chief Technology Officer This role covers the design of digital, mixed-signal and radio-frequency (RF) electronics for unmanned aircraft. The work spans schematic capture, high-speed and RF printed circuit board (PCB) layout, design verification, prototyping, and release of manufacturing documentation. You will translate system-level requirements into board-level designs that meet performance, manufacturability, electromagnetic compatibility and signal-integrity targets, working alongside firmware, mechanical, optical and systems engineers to deliver complete products. ‍ What You Will Work On Airborne electronics across three broad areas:
- Avionics and control electronics
- sensor-rich mixed-signal boards with low
- noise analogue front ends, deterministic serial and CAN interfaces, and redundancy and fail-safe provisions.
• RF and software-defined radio
- transceiver front ends, filtering and switching, low-jitter clock and local-oscillator distribution, high-speed converter interfaces, and isolation and shielding for co-located radios.
• Compute and payload boards
- carrier and interface boards for embedded compute modules, with multi-gigabit serial links, camera and network interfaces, storage, and sequencing and thermal provisions. ‍ ‍

Key Responsibilities
Translate system-level requirements into board-level electrical requirements and architecture.
• Produce schematics and multi-layer PCB layouts for digital, mixed-signal and RF designs using Altium Designer or an equivalent ECAD tool.
• Apply high-speed design practice: controlled-impedance transmission lines, length and skew matching, termination strategy, return-path integrity and stack
- up planning.
• Apply RF layout practice: 50 Ω routing, grounding and via stitching, transmit/receive isolation, and shielding.
• Design for electromagnetic compatibility and interference (EMC/EMI) at both board and system level, and support pre-compliance and formal testing.
• Run signal-integrity simulation (HyperLynx or similar) and circuit and system simulation (LTspice, QSpice, MATLAB/Simulink).
• Carry out design-for-manufacture (DFM) and design-for-test reviews, and select components with EU/NATO supply-chain and export-control constraints in mind.
• Build, bring up, debug and validate prototypes using vector network analysers, spectrum analysers, EMI receivers, oscilloscopes and laboratory supplies.
• Optimise designs against cost, availability, thermal and performance targets.
• Maintain design data, libraries and documentation under version control, and release complete manufacturing packages (fabrication, assembly, bill of materials, test).
• Work with firmware, software, mechanical and optical engineers through integration and qualification. ‍ ‍ Experience & Skills
• Bachelor's or Master's degree in electronic engineering or a related field.
• At least 5 years designing schematics and multi-layer PCBs for high-speed or high-frequency products.
- Demonstrated RF design work from roughly 100 MHz to 6 GHz, including front
- end and antenna-interface design.
• Experience with high-speed digital systems built around microcontrollers, processors, FPGAs or GPUs
- including at least one of DDR memory, PCI Express, USB 3.x, Ethernet or MIPI camera interfaces.
• Hands-on experience with SMD component soldering and PCB rework.
• Demonstrated ability to debug and troubleshooting high-frequency circuits, including impedance measurement and characterization using a VNA and related RF test equipment.
• Familiarity with MIPI camera interfaces, satellite navigation (GNSS/GPS) receivers, Ethernet and CAN, preferably DroneCAN.
• Strong grasp of EMC/EMI control at both layout and system level.
- Working knowledge of IPC standards for PCB design (IPC-2220 series, IPC
- 7351, IPC-7352) and of IPC product classes.
• Clean criminal record. Nice to have
• Experience with flight-control or avionics hardware, and familiarity with open autopilot ecosystems.
• Experience with software-defined radio transceivers and low-phase-noise clocking.
• Experience designing carrier or interface boards for embedded compute modules.
• Familiarity with airborne environmental and EMC qualification such as RTCA DO-160 or MIL-STD-461/810.
• Thermal and mechanical awareness for compact, weight-constrained airborne assemblies.
• Ability to lead technical tasks and coordinate engineering activities.
• Nationality of an EU/NATO member state or of a NATO partner (Australia, Japan, New Zealand, South Korea), or Ukraine. ‍